MCF-5000I is superior in dimensional stability and flexibility for
multilayer PWB : composite of Hitachi original polyimide resin and ultra
thin copper foil. TC-C-300Details
Features
• High heat resistance suitable for Pb-free solder process.
• Superior dimensional stability with ultra-thin glass fabric. Similar processability to conventional FR-4.
• Dust-free property suitable for clean fabrication of PWB.
• Good dimensional stability.
• Superior high frequency property, low Dk less than the 3.0 (1GHz).
• Good flexibility with ultra thin copper foil.
Characteristics
Products line up
General properties
Item
Condition
Unit
MCF-5000ID
MCF-5000IR
High Heat Resistance
Heat resistance
288°C Float
s
>180
>180
TMA
CTE x,y
ppm/°C
20~22
20~22
CTE z*
ppm/°C
–
180~220
Tg
°C
–
230~250
Elastic modulus
E'(25°C, DVE)
GPa
3.5~5.0
2.0~3.0
Dielectric constant
1GHz
–
2.9~3.0
–
Dissipation factor
1GHz
–
0.002~0.004
–
Water absorption
PCT 3h
wt%
0.6~0.8
1.2~1.4
Peel strength
(18μm)
kN/mm
0.7~0.9
0.7~0.9
Dimentional
stability
After Et,(MD)
%
-0.01±0.03
–
After Et,(TD)
-0.01±0.03
–
Insulation
resistance
L/S=50/50
85°C/85%RH
Ω
–
1×109~1×1010
Flammability
UL
–
V-0
(VTM-0)***
Resin powder
–
–
(None)
(None)
•*CTE z : 8piles(TC series),
•**TC-F,
•***To be submitted to Application
8layer construction
•Low elastic modulus adhesive layer.(1)(3)(4)
•⇒Good molding property with high reliability
•⇒Reduce thickness,Simplified the production
process
•PI layer itself beneath copper foil.(2)
• ⇒Good bendability.Cover layer substitute
•⇒Good chemically resistant
Applications
·Mobile phone, Digital camera, Mobile audio player, Medical
equipment etc.