MCL-E-73, High Heat Resistance Multilayer Material (FR-4) has superior heat resistance property, which is suitable for lead free soldering process with lower CTE and excellent through-hole reliability.
It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc.
Features
Superior solder heat resistance. (Suitable for lead-free process)
The coefficient of thermal expansion is lower than that of our standard FR-4 which enables excellent through-hole reliability. Suitable for punching process.
Characteristics
*1.PCT:121°C, 0.22/MPa
*2.Measured by triplate-line resonator
T-288(with copper)
(IPC TM-650)
Through-hole reliability
-55°C30min ⇔150°C30min(t1.0)
Applications
Electronic for automobiles, Personal computers,Electronic branch exchanges, copie montres etc