MCL-E-679 Type(W) is high-Tg glass epoxy material with high heat resistance, superior moisture and CAF restraining properties. It is well suited for semiconductor package substrate, high density electronic equipment, burn-in-board etc..
Applications
Semiconductor packages .(BGA, CSP and MCM) Main frame computers, Telephone switchboards, Mobile phones, Semiconductor testing devices and burn-in boards. Electronics for automobiles.